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Compute Chips

The Post-Moore Path for AI Chips: Advanced Packaging Succeeds Process Scaling

For decades, the semiconductor industry rode a remarkably simple storyline: shrink transistors, pack more of them onto a die, and enjoy automatic gains in performance and efficiency. That story—embodied in Moore’s Law—still matters, but for AI chips in the mid‑2020s it is no longer the sole, or even primary, driver of progress.

Compute Chips

Global AI Accelerator Market Breaks $250B in 2026: A Supply Chain Teardown
Compute Chips

AI Chip TDP Grows 50% Per Gen, Data Center Power Architecture Faces Reassessment
Macro Linkages

A Quarterly Tracking Framework for Semi Buyback Scale and FCF Yield

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Thematic ETFs

Cyclical Pricing Power Shifts Reflected by the HHI Industry Concentration Index for Memory
Thematic ETFs

Active Correction Strategies for the Systematically Underweighted Memory Weight in AI Compute Indices
Advanced Packaging

The Three-Headed Race in Advanced Packaging: TSMC, Intel, and ASE
HBM Memory

The Dual Impact of HBM Reliability Test Standard Upgrades on Yield and Cost
HBM Memory

HBM4 Mass Production Kickoff: The 2026 Tech Roadmap Showdown Among 3 Memory Giants
Storage

Server DRAM vs. Mobile DRAM Price Divergence: Arbitrage Opportunity Analysis

Popular

Narrowing Spread Between NAND Spot and Contract Prices in 2026 – A Signal

By 2026, one of the most watched metrics in the NAND flash market has started to shift in a subtle but meaningful way: the spread between spot prices and long‑term contract prices is narrowing. For casual observers, this may look like just another incremental change in a notoriously volatile industry. For memory makers, module houses, device OEMs, and data center buyers, however, a tightening gap between spot and contract prices is a signal—a reflection of evolving supply–demand balance, risk perceptions, and strategic behavior on both sides of the market.

Price Divergence Trading Strategies Between NAND Flash and DRAM ETFs

NAND flash and DRAM sit at the core of AI storage and computing power. Both are memory, but they are not the same business. DRAM is main memory—fast, volatile, and central to high‑bandwidth workloads like AI training and inference. NAND is non‑volatile storage—slower than DRAM, but crucial to persistent data and large‑scale object storage. The cycles that drive their pricing and margins overlap, yet they often diverge. That divergence is where trading strategies between NAND and DRAM ETFs become interesting.

China’s HBM Localization Progress: The Catch-Up Pace of CXMT and XMC

Thermal Simulation Challenges and Solutions in 3DIC AI Chip Design

An Attempt at Compiling a Memory+Compute Fusion Thematic Index – A Dual-Track Framework

Thematic ETFs

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Thematic ETFs

Record New Launches of Memory/AI Thematic ETFs in 2026 – Capital Siphoning Effects

The 2026 boom in memory and AI-themed ETFs has done more than add a few tickers to the market. It has rewired how capital finds its way into AI storage and computing power. Funds like pure‑play memory ETFs and AI hardware baskets raised billions within weeks, breaking launch records that were previously reserved for broad index or Bitcoin products. That speed is not just a measure of investor enthusiasm; it is evidence of a capital siphoning effect, where money that might have gone into individual memory names, broad semis, or general AI equity now flows through a concentrated thematic wrapper instead.

2026 Investor Structure Shifts in Memory Thematic ETFs – Retail Out, Institutions In
Thematic ETFs

A High-Frequency Leading Indicator Model Linking Memory Indices and PC/Smartphone Shipments
Thematic ETFs

Overweight/Underweight Execution via Memory Thematic ETFs in Sector Rotation

Macro Cycle

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Macro Cycle

Intensifying Semi Sector Divergence: The Trilogy of Analog, Digital, and Power

The semiconductor industry is no longer a single, unified story. Instead, it is increasingly a trilogy—three distinct but interdependent sectors whose economics, technology roadmaps, and demand cycles are diverging: analog, digital, and power. On the surface, all three deal with silicon and electrons; in practice, they respond to different customer needs, move at different speeds, and face different constraints.

Macro Cycle

R&D Intensity Ranking in Semis: Who Keeps Doubling Down on the Future?

In semiconductors, research and development is not just a line item—it is the engine that determines who sets the pace of technology and who follows. R&D intensity, usually measured as R&D spending as a percentage of revenue, reveals how aggressively companies are investing in their future versus harvesting their present.

Macro Cycle

Interpreting the Sentiment Signal as Wafer Fab Utilization Breaches 85%

Wafer fab utilization is one of the semiconductor industry's most closely watched operational metrics. When utilization climbs above key thresholds, it has ripple effects across pricing, lead times, equipment demand, supplier margins, and market sentiment.
Macro Cycle

Japan’s Semi Renaissance: Joint 2nm R&D Progress Among 8 Major Giants

Japan’s semiconductor industry is experiencing a genuine renaissance. After decades in which the country’s role shifted from dominant memory and logic supplier to more specialized niches in equipment, materials, and certain devices, a new wave of coordinated effort is pushing Japan back toward the leading edge of process technology.

Storage

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Storage

Memory Inventory Digestion Nearing End, Channel Restocking Intentions Strengthen
Storage

Shortages in DDR5 PMIC and SPD Hub Supply Chain
Storage

RAID and Erasure Coding Evolution – New Durability Requirements for NAND
Storage

Enterprise NVMe SSD Share Jumps in AI Data Center Procurement Lists

Advanced Packaging

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The Three-Headed Race in Advanced Packaging: TSMC, Intel, and ASE

Competitive Landscape of Advanced Packaging: The Coopetition Between OSATs and Foundries

New Standards for Cleanroom Grades and Environmental Requirements in Advanced Packaging

Macro Linkages

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Macro Linkages

Quarterly Changes in Global Systemically Important Banks’ Credit Policies for Semis

Semiconductors have moved from a niche industry to the backbone of the global economy. Chips power everything from smartphones and cars to data centers and industrial robots. Behind that impressive hardware, however, sits a quieter but equally important structure: the flow of credit that finances fabs, equipment, inventory, and research. At the center of this structure are Global Systemically Important Banks (G-SIBs), whose quarterly changes in credit policies can subtly, and sometimes not so subtly, reshape the semiconductor landscape.
Macro Linkages

The Chain Reaction of BOJ Rate Hikes on Yen Financing Costs for Equipment Giants
Macro Linkages

The Inverse Relationship Between Mutual Funds’ Overweight Ratio in Semis and Forward Returns

HBM Memory

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HBM Memory

Incremental Demand for HBM Test and Burn-in Equipment – A Quantified Forecast

As High-Bandwidth Memory (HBM) moves from niche to mainstream across AI, HPC, and advanced graphics, test and burn-in equipment emerges as a critical bottleneck. HBM modules require more extensive, higher-fidelity testing than commodity DRAM: multi-die functional tests, high-speed channel validation, thermal stress profiles, and system-level burn-in under representative accelerator loads.
HBM Memory

HBM’s Value Share Per AI Server Unit Continues to Rise
HBM Memory

HBM4 Mass Production Kickoff: The 2026 Tech Roadmap Showdown Among 3 Memory Giants
HBM Memory

TSV Technology Iteration in HBM – New Requirements for Equipment Suppliers
HBM Memory

The Dual Impact of HBM Reliability Test Standard Upgrades on Yield and Cost
HBM Memory

Global HBM Patent Landscape Competition: The US-China-Japan-Korea Power Game

High-Bandwidth Memory (HBM) has become one of the most strategically important technologies in the AI and high‑performance computing era. Patents around HBM architectures, hybrid bonding, TSVs, interposers, thermal solutions and test methods now form a dense web of intellectual property that shapes who can manufacture, license and profit from AI memory at scale. The global HBM patent landscape is increasingly a power game among the United States, China and Japan, layered on top of Korean and Taiwanese industrial strengths.

ETFs

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ETFs

Market Sentiment Revealed by Changes in Semi ETF PCF Baskets

If you spend any time in the semiconductor space, you quickly realize that prices do not move only on earnings calls and product launches. They also move on flows, on mechanics, on the quiet, daily processes that keep exchange-traded funds running. One of the most important of those processes is the construction of the Portfolio Composition File, or PCF – the basket that authorized participants use to create and redeem ETF shares. When we talk about semi-themed ETFs, the evolution of those PCF baskets can be a surprisingly rich source of information about what the market is really thinking.

ETFs

Correlation Matrix and Diversification Benefits of US vs. A-Share Semi ETFs
ETFs

The Pricing Impact of SOXX’s Portfolio Changes on Individual Constituents
ETFs

Lead-Lag Relationship Between Global Semi ETF Flows and Korea Semi Export Data
ETFs

Can Smart Beta Semi ETFs Outperform Traditional Cap-Weighted Products?
ETFs

12 Consecutive Weeks of Net Inflows into Semi ETFs – The Smart Money Allocation Logic

Compute Chips

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Compute Chips

Practical Breakthroughs of Domestic EDA Tools in AI Chip Design (Huada/Prime)

As AI chips surge to the forefront of national technology strategies, attention has increasingly turned from fabs and packaging to a crucial but less visible layer: electronic design automation (EDA). For many years, domestic EDA tools lagged behind international leaders, limiting how far local firms could push advanced AI chip design without external dependencies.

FCF Inflection Point Forecasting Model for Leading AI Chip Companies
Compute Chips

AI Chip TDP Grows 50% Per Gen, Data Center Power Architecture Faces Reassessment
Compute Chips

Global AI Accelerator Market Breaks $250B in 2026: A Supply Chain Teardown

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